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Application Notes
an0001 FlexiCap™ Termination
an0002 Bend Testing
an0004 Quality and Reliability Data
an0005 Mechanical Cracking
an0006 Capacitance Ageing of Ceramic Capacitors
an0010 The Effect of Lead Free Soldering on Bend Test
an0011 Solder Alloy Choice for Through Hole Ceramic Discoidal
an0012 Electronic Lighting Ballasts
an0013 Packaging Labels
an0014 X2Y Balanced Line EMI Chip
an0016 Micro sectioning Of Multilayer Ceramic Capacitors
an0018 EMI Suppression for DC Motors using X2Y Components
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